MATERIALS CHARACTERIZATION AND ANALYTICAL SKILLS:
• ESEM, SEM, FIB and X-SEM, EDS, XPS, AFM, Profilometry, Spectroscopic Reflectometery, 4-Points Probes, Dynamitron Accelerator, Rutherford Backscattering & ion implantation, Fast Neutron Spectroscopy, TOPCON-SP1, LEICA Microscope, Electrical Probe, X-rays Spectroscopy, Kelvin Probe Force Microscopy, KLA-Tencor F5 film measurement tool. Moreover course work on TEM, SEM, XRD.
MATERIALS PROCESSING SKILLS:
• Chemical Mechanical Planarization & Polishing, Etching, Deposition, Coating, Wire Bonding, and Plating. Moreover training and course work on Lithography and Semiconductor Processing.
SOFTWARE SKILLS:
• MS Office suite and Lotus Notes.
• Data Analysis software: Origin, JMP, Scion Images, Baldy, WSPC, Exceed on Demand, Nanoscope III, CASINO (Monte Carlo simulations), and CITZAF.
• MEMS software: L-Edit TM Layout Editor, IntelliSuite’s 3D Interactive Builder, ANSYS Modeling.
• Semiconductor Processing and endpoint software: ISRM (in-situ removal monitoring), RTPC (real time process control), WL (White light), and Reflexion LK processing simulators.
• Automation and integrated manufacturing SiView (MM and SM Clients) execution systems.